The QSiC Dual3 family of 1,200-V half-bridge MOSFET modules developed by SemiQ Inc. targets motor drives in data center cooling systems, grid converters in energy storage systems, and industrial ...
Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal ...
KYOTO, Japan, March 12, 2026 /PRNewswire/ -- ROHM Co., Ltd. has begun online sales of new SiC molded modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247. Amid growing concerns over tightening global ...
Six 2300-V baseplate-less power modules from Wolfspeed boost energy efficiency in renewable energy, energy storage, and fast charging applications. These half-bridge modules, optimized for 1500-V DC ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet the stringent High Humidity High Voltage High Temperature Reverse Bias ...
UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to deliver ultra-fast switching high efficiency and enhanced thermal management ...
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