Semiconductor Engineering

Tackling Chip Complexity With Integrated System-Level Test Solutions

As the sophistication of semiconductors continues to grow, so does the need for system-level test (SLT) in production to ensure that high-performance processors, chiplets, and other advanced devices ...
Morningstar

Teradyne Introduces Integrated Test Solution for AI and Data Center Devices in Collaboration with Tokyo Electron

Teradyne’s UltraFLEXplus platform paired with Tokyo Electron’s probing technology delivers known good device screening for advanced 2.5D/3D packages. Teradyne, Inc. (NASDAQ: TER), a leading provider ...
Semiconductor Engineering

Multi-die Testing In The Field Must Build On Established Test Methodologies

The AI revolution is significantly outpacing the IC industry’s ability to sufficiently test multi-chip systems for all necessary failure mechanisms at probe, final test, and system-level test. The ...
Data Center Frontier

Data Center Insights: Robert Danforth, Rehlko

Robert Danforth argues that AI infrastructure is entering an era where system performance—not simply installed power capacity ...

Aehr Receives Follow-On Order From Major Silicon Photonics Customer for Fully Automated Wafer-Level Burn-In System for Hyperscale Data Center Optical Interconnect

Detailed price information for Aehr Test Systems (AEHR-Q) from The Globe and Mail including charting and trades.
EurekAlert!

Workshop tackles AI data center power, security challenges

Prasad Kandula, ORNL group leader for Grid Systems Hardware, explains medium-voltage direct current (MVDC) hardware testing capabilities during a tour of the GRID-C as part of the NGDC Workshop.

ISC2026: KAYTUS Launches Gigawatt-Scale Prefabricated AI Factory Data Center

At ISC 2026, KAYTUS, a leading provider in AI infrastructure and liquid cooling solutions, unveiled its gigawatt scale, fully prefabricated containerized liquid cooled data center solution. Based on a ...